Name: High Tg Thick Copper Foil Multilayer Board
Number of floors: 12
Material: High Tg (170 ℃) FR-4
Plate thickness: 3.2mm
Surface treatment: immersion gold
Features: Each layer of copper foil has a thickness of 40Z (140um) and is equipped with blind buried hole technology for high electrical output
Application: DC/DC power module
